Title:
PACKAGE STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/050842
Kind Code:
A1
Abstract:
The present application provides a package structure and an electronic device. The package structure comprises an internal circuit and a package housing that packages the internal circuit. The package housing comprises a first surface; the first surface is provided with a heating layer; and the heating layer comprises a line connected between a first soldering leg and a second soldering leg on the first surface. The internal circuit is a temperature-sensitive circuit, and a temperature change may affect the working state of the internal circuit. After the first soldering leg and the second soldering leg are powered on, and voltage is applied thereto, the line of the heating layer can generate heat, so as to heat the package structure, such that a temperature change of the working environment of the internal circuit is reduced, and the temperature characteristic of the internal circuit is improved. The heating layer does not require other heat-conducting media and is arranged on the first surface of the package housing, so that the heat transfer efficiency is high, and less power is consumed by the heating layer.
Inventors:
TUO YONG (CN)
GONG TAO (CN)
ZHANG JIALIANG (CN)
CHENG XIATONG (CN)
ZHAO FEILONG (CN)
ZHA FENGTAO (CN)
SUN LIGUO (CN)
GONG TAO (CN)
ZHANG JIALIANG (CN)
CHENG XIATONG (CN)
ZHAO FEILONG (CN)
ZHA FENGTAO (CN)
SUN LIGUO (CN)
Application Number:
PCT/CN2022/118259
Publication Date:
March 14, 2024
Filing Date:
September 09, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H03B5/32; H03B5/04
Foreign References:
| JP2007201858A | 2007-08-09 | |||
| JP2003224422A | 2003-08-08 | |||
| CN106559070A | 2017-04-05 | |||
| US20140145559A1 | 2014-05-29 | |||
| CN102035466A | 2011-04-27 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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