Title:
PACKAGE SUBSTRATE AND FORMING METHOD THEREFOR, AND PACKAGE STRUCTURE AND FORMING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/164337
Kind Code:
A1
Abstract:
The present invention relates to a package substrate and a forming method therefor, as well as a package structure and a forming method therefor. The package substrate comprises: a substrate having a first surface and a second surface that oppose each other; and at least one gas removal hole which passes through the first surface and the second surface of the substrate, where the gas removal hole at least comprises one long strip-shaped hole. The package substrate is advantageous in improving the filling effect of a molding material during injection, and improves the reliability of the package structure formed.
Inventors:
WU PING-HENG (CN)
Application Number:
PCT/CN2020/128342
Publication Date:
August 26, 2021
Filing Date:
November 12, 2020
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/13
Foreign References:
| CN211404481U | 2020-09-01 | |||
| CN209419980U | 2019-09-20 | |||
| CN209419980U | 2019-09-20 | |||
| CN105914155A | 2016-08-31 | |||
| CN203590586U | 2014-05-07 | |||
| CN203590586U | 2014-05-07 | |||
| JPH03157944A | 1991-07-05 |
Other References:
See also references of EP 3933910A4
Attorney, Agent or Firm:
SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)
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