Title:
PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/021661
Kind Code:
A1
Abstract:
Provided is a package which does not greatly impair the smoothness of opening operation of a packaging material even if a label is stuck on the outer surface of the packaging material and enables reading of an indication provided on the label without difficulty. A package 1 comprises a product 2 and a packaging material 3 for packaging the product 2, wherein a packaging material disconnection guide line 8 for guiding disconnection of the packaging material 3 and opening of the packaging material 3 is formed at the packaging material 3. The package 1 further comprises a label 4 having an indication 7B related to the product 2, the label 4 being attached to the outer surface of the packaging material 3 so as to cover at least a portion of the packaging material disconnection guide line 8. Label disconnection guide lines 9 for guiding disconnection of the label 4 are formed on the label 4, and at least one label disconnection guide line 9A for the packaging material disconnection guide line 8 covered with the label 4 is arranged along the packaging material disconnection guide line 8.
Inventors:
NISHIURA DAIKI (JP)
Application Number:
PCT/JP2021/030415
Publication Date:
February 23, 2023
Filing Date:
August 19, 2021
Export Citation:
Assignee:
KOBAYASHI PHARMACEUTICAL CO LTD (JP)
International Classes:
B65D75/36
Domestic Patent References:
| WO2008146836A1 | 2008-12-04 |
Foreign References:
| JP2019104540A | 2019-06-27 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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