Title:
PACKAGING LAYER AND PACKAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/082150
Kind Code:
A1
Abstract:
A packaging layer (130). The packaging layer (130) comprises a first inorganic functional layer (132), and an organic buffer layer (133) covering the first inorganic functional layer (132). A surface of the first inorganic functional layer (132) which contacts with the organic buffer later (133) has a plurality of grooves (135). A surface of the organic buffer later (133) which contacts with the first inorganic functional layer (132) has a plurality of protrusions (136) respectively corresponding to and matching with the plurality of grooves (135), for allowing the plurality of protrusions (136) to be respectively embedded into the plurality of corresponding grooves (135). And a package device (100) comprising the described packaging layer (130).
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Inventors:
JIN JIANGJIANG (CN)
HSU HSIANG-LUN (CN)
HUANG JINCHANG (CN)
JIANG QIAN (CN)
HSU HSIANG-LUN (CN)
HUANG JINCHANG (CN)
JIANG QIAN (CN)
Application Number:
PCT/CN2016/108337
Publication Date:
May 11, 2018
Filing Date:
December 02, 2016
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L51/52
Foreign References:
| CN105206763A | 2015-12-30 | |||
| US9070889B2 | 2015-06-30 | |||
| US20120256201A1 | 2012-10-11 | |||
| CN105140417A | 2015-12-09 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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