PACKAGING MATERIAL FOR MOLDING MATERIAL AND PART FOR SEMICONDUCTOR EQUIPMENT, METHOD OF PACKAGING BY USING THE SAME AND PACKAGED MOLDING MATERIAL AND PART FOR SEMICONDUCTOR EQUIPMENT

Title:

PACKAGING MATERIAL FOR MOLDING MATERIAL AND PART FOR SEMICONDUCTOR EQUIPMENT, METHOD OF PACKAGING BY USING THE SAME AND PACKAGED MOLDING MATERIAL AND PART FOR SEMICONDUCTOR EQUIPMENT

Document Type and Number:

WIPO Patent Application WO/2000/003928

Kind Code:

A1

Abstract:

A packaging material capable of maintaining a highly clean state, which has a number of the particles with a particle diameter of 0.2 $g(m)m or more being present on the surface facing an article to be packaged of 5000 particles/cm?2¿ or less, a permeability for steam of 30 g/cm?2¿.24 hr or less, the total amount of evolved gases during being heated for 15 minutes at 80 °C of 5 ppm or less, and the total amount of evolved moisture during being heated for 30 minutes at 80 °C of 13 ppm or less.

Inventors:

HIGASHINO KATSUHIKO (JP)
HASEGAWA MASANORI (JP)
NOGUCHI TSUYOSHI (JP)
KISHINE MITSURU (JP)

Application Number:

PCT/JP1999/003790

Publication Date:

January 27, 2000

Filing Date:

July 14, 1999

Export Citation:

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Assignee:

DAIKIN IND LTD (JP)
HIGASHINO KATSUHIKO (JP)
HASEGAWA MASANORI (JP)
NOGUCHI TSUYOSHI (JP)
KISHINE MITSURU (JP)

International Classes:

B32B15/08; B32B27/08; B65D65/40; (IPC1-7): B65D65/40; B65D85/38

Foreign References:

JPH0848370A	1996-02-20
JPS63272542A	1988-11-10
US3442686A	1969-05-06

Other References: