Title:
PACKAGING MICROELECTROMECHANICAL STRUCTURES
Document Type and Number:
WIPO Patent Application WO2003084862
Kind Code:
A3
Abstract:
A microelectromechanical system (32) may be enclosed in a hermetic cavity (44) defined by joined, first and second semiconductor structures (14, 12). The joined structures (14, 12) may be sealed by a soldier sealing ring (18), which extends completely around the cavity (44). One of the semiconductor structures (14, 12) may have the system (32) formed thereon and an open area (38) may be formed from the underside of the structure (14, 12) and may be closed by covering with a suitable film (20) in one embodiment.
Inventors:
MA QING
RAO VALLURI
WANG LI-PENG
TRAN QUAN
HECK JOHN
RAO VALLURI
WANG LI-PENG
TRAN QUAN
HECK JOHN
Application Number:
PCT/US2003/009620
Publication Date:
March 18, 2004
Filing Date:
March 27, 2003
Export Citation:
Assignee:
INTEL CORP (US)
International Classes:
B81B7/00; (IPC1-7): B81C3/00
Foreign References:
| EP0994330A1 | 2000-04-19 | |||
| US20010055836A1 | 2001-12-27 | |||
| US6140144A | 2000-10-31 |
Other References:
BROWN A R ET AL: "Micromachined micropackaged filter banks and tunable bandpass filters", WIRELESS COMMUNICATIONS CONFERENCE, 1997., PROCEEDINGS BOULDER, CO, USA 11-13 AUG. 1997, NEW YORK, NY, USA,IEEE, US, PAGE(S) 193-197, ISBN: 0-7803-4194-5, XP010245585
MAYER F ET AL: "Flip-chip packaging for smart MEMS", SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, SAN DIEGO, CA, USA, 2-4 MARCH 1998, PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, 1998, SPIE-INT. SOC. OPT. ENG, USA, PAGE(S) 183 - 193, ISSN: 0277-786X, XP001157226
MARKUS K W ET AL: "SMART MEMS: FLIP CHIP INTEGRATION OF MEMS AND ELECTRONICS", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, VOL. 2448, PAGE(S) 82-92, ISSN: 0277-786X, XP001039856
DRAYTON R F ET AL: "ADVANCED MONOLITHIC PACKAGING CONCEPTS FOR HIGH PERFORMANCE CIRCUITS AND ANTENNAS", 1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST. SAN FRANCISCO, JUNE 17 - 21, 1996, IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, NEW YORK, IEEE, US, VOL. VOL. 3, PAGE(S) 1615-1618, ISBN: 0-7803-3247-4, XP000720652
HEUNG-WOO PARK ET AL: "Packaging of the RF-MEMS switch", DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS II, ADELAIDE, SA, AUSTRALIA, 17-19 DEC. 2001, PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, 2001, SPIE-INT. SOC. OPT. ENG, USA, PAGE(S) 234 - 243, ISSN: 0277-786X, XP001157230
MAYER F ET AL: "Flip-chip packaging for smart MEMS", SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, SAN DIEGO, CA, USA, 2-4 MARCH 1998, PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, 1998, SPIE-INT. SOC. OPT. ENG, USA, PAGE(S) 183 - 193, ISSN: 0277-786X, XP001157226
MARKUS K W ET AL: "SMART MEMS: FLIP CHIP INTEGRATION OF MEMS AND ELECTRONICS", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, VOL. 2448, PAGE(S) 82-92, ISSN: 0277-786X, XP001039856
DRAYTON R F ET AL: "ADVANCED MONOLITHIC PACKAGING CONCEPTS FOR HIGH PERFORMANCE CIRCUITS AND ANTENNAS", 1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST. SAN FRANCISCO, JUNE 17 - 21, 1996, IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, NEW YORK, IEEE, US, VOL. VOL. 3, PAGE(S) 1615-1618, ISBN: 0-7803-3247-4, XP000720652
HEUNG-WOO PARK ET AL: "Packaging of the RF-MEMS switch", DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS II, ADELAIDE, SA, AUSTRALIA, 17-19 DEC. 2001, PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, 2001, SPIE-INT. SOC. OPT. ENG, USA, PAGE(S) 234 - 243, ISSN: 0277-786X, XP001157230
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