Title:
PACKAGING STRUCTURE OF IMAGE CHIP AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/073371
Kind Code:
A1
Abstract:
Provided are a packaging structure of image chip and a manufacturing method, which belongs to the field of semiconductor packaging. In the present invention, a light-absorbing layer is respectively formed at the position where the non-functional surface of the image chip directly faces the photosensitive area and at the side wall of the chip, which can effectively prevent light from entering the photodiode of the chip device layer through the non-functional surface and side wall of the image chip, thereby reducing the interference light incident on the light sensitive area, and improving the quality of imaging.
Inventors:
QIN FEI (CN)
ZHAO SHUAI (CN)
ZHANG LIXIANG (CN)
CHEN PEI (CN)
AN TONG (CN)
DAI YANWEI (CN)
XIAO ZHIYI (CN)
ZHAO SHUAI (CN)
ZHANG LIXIANG (CN)
CHEN PEI (CN)
AN TONG (CN)
DAI YANWEI (CN)
XIAO ZHIYI (CN)
Application Number:
PCT/CN2018/112618
Publication Date:
April 16, 2020
Filing Date:
October 30, 2018
Export Citation:
Assignee:
UNIV BEIJING TECHNOLOGY (CN)
International Classes:
H01L27/146; H01L23/28
Foreign References:
| CN106449546A | 2017-02-22 | |||
| CN101038926A | 2007-09-19 | |||
| CN107221516A | 2017-09-29 | |||
| CN105374836A | 2016-03-02 | |||
| US20130328148A1 | 2013-12-12 |
Attorney, Agent or Firm:
BEIJING SIHAI TIANDA INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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