Title:
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/103964
Kind Code:
A1
Abstract:
A packaging structure and a manufacturing method therefor. The packaging structure comprises: a first module comprising a first dielectric layer, a first circuit and a first device, wherein the first circuit and the first device are arranged on the first dielectric layer, the first circuit is electrically connected to the first device, and the first dielectric layer extends along a first direction; a second module comprising a second dielectric layer, a second circuit and a second device, wherein the second circuit and the second device are arranged on the second dielectric layer, the second circuit is electrically connected to both the second device and the first circuit, and the second dielectric layer extends along a second direction, an included angle being formed between the second direction and the first direction; and a packaging layer wrapping at least part of the outer side surfaces of the first device and the second device.
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Inventors:
YANG LINKUN (CN)
XU JIAN (CN)
LI CHENGXIANG (CN)
XU JIAN (CN)
LI CHENGXIANG (CN)
Application Number:
PCT/CN2022/136608
Publication Date:
June 15, 2023
Filing Date:
December 05, 2022
Export Citation:
Assignee:
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD (CN)
International Classes:
H01L23/498; H01L21/48; H01L21/768; H01L23/538
Foreign References:
| CN114171490A | 2022-03-11 | |||
| CN214505473U | 2021-10-26 | |||
| CN113161335A | 2021-07-23 | |||
| CN207250499U | 2018-04-17 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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