Title:
PACKAGING STRUCTURE AND PACKAGING METHOD FOR OLED DISPLAY COMPONENT, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/219270
Kind Code:
A1
Abstract:
Disclosed are a packaging structure and a packaging method for an OLED display component, and a display device. The packaging method for the OLED display component comprises: providing a substrate, the substrate comprising a packaging area and a binding area located around the packaging area, a binding electrode lead being provided on the binding area; forming a sacrificial layer on the binding electrode lead; forming an OLED display component in the packaging area; forming a packaging thin film covering the packaging area and the binding area; removing the sacrificial layer, thus allowing the sacrificial layer and the packaging thin film arranged on the sacrificial layer to be separated from the substrate. The packaging method provided in the present disclosure for the OLED display component is for use in packaging the OLED display component.
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Inventors:
WANG YULIN (CN)
Application Number:
PCT/CN2018/088850
Publication Date:
December 06, 2018
Filing Date:
May 29, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L51/56; H01L51/52
Foreign References:
| CN107104202A | 2017-08-29 | |||
| KR20120116782A | 2012-10-23 | |||
| CN104485347A | 2015-04-01 | |||
| CN104022233A | 2014-09-03 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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