Title:
PAD SEPARATION ASSEMBLY-TYPE LAMINATING MOLD AND HOT MELT LAMINATING PRESS USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/108970
Kind Code:
A1
Abstract:
The present invention provides a pad separation assembly-type laminating mold and hot melt laminating press using same. According to the present invention, in said pad separation assembly-type laminating mold and hot melt laminating press using same, a pressure pad of a resilient material is separated in a mold and is detachably inserted and fixed to the mold in order to smoothly laminate the material so that resistance to thermal expansion and thermal contraction of the pressure pad is minimized, deformation of or damage to the pressure pad is prevented, and the service life of the pressure pad can be extended. The pad separation assembly-type laminating mold according to the present invention comprises: a mold main body having an insertion recess formed in the surface thereof and a heating element disposed therein; a body frame detachably inserted and fixed to the insertion recess in the surface of the mold main body, including a pressure pad formed of a resilient material, and formed at a height at which an outwardly open work space is set for the hot melt laminating press using the pad separation assembly-type laminating mold according to the present invention; a laminating mold formed as a top mold and a bottom mold disposed at the top and bottom sides in the work space for the body frame, and having a heating element disposed therein so as to be heated to a set temperature; a punching tool installed at the top of the body frame and coupled to the top mold, and inducing a vertical reciprocating movement of the top mold; a transfer tool installed at the bottom of the work space of the body frame and inducing a horizontal movement of the bottom mold; and a controller for controlling the operations of the heating element, the punching tool, and the transfer tool of the laminating mold.
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Inventors:
JANG JI SANG (KR)
CHOI JONG YUN (KR)
JHUN SEUNG CHUL (KR)
KIM KI HWAN (KR)
CHOI JONG YUN (KR)
JHUN SEUNG CHUL (KR)
KIM KI HWAN (KR)
Application Number:
PCT/KR2012/005482
Publication Date:
July 25, 2013
Filing Date:
July 11, 2012
Export Citation:
Assignee:
ASSEMS INC (KR)
JANG JI SANG (KR)
CHOI JONG YUN (KR)
JHUN SEUNG CHUL (KR)
KIM KI HWAN (KR)
JANG JI SANG (KR)
CHOI JONG YUN (KR)
JHUN SEUNG CHUL (KR)
KIM KI HWAN (KR)
International Classes:
B29C43/20; B29C43/32; B29C65/02; B32B37/00
Foreign References:
| JPH10263297A | 1998-10-06 | |||
| KR20080040485A | 2008-05-08 | |||
| JP2009095869A | 2009-05-07 | |||
| JP2006212859A | 2006-08-17 |
Attorney, Agent or Firm:
STY PATENT LAW FIRM (KR)
특허법인 신태양 (KR)
특허법인 신태양 (KR)
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Claims: