PARALLELISM ADJUSTMENT METHOD AND PARALLELISM ADJUSTMENT APPARATUS FOR MOUNTING APPARATUS

WIPO Patent Application WO/2012/050096

A1

[Objective] To provide a parallelism adjustment method and a parallelism adjustment apparatus for a mounting apparatus, wherein parallelism between a substrate stage and a bonding tool can be adjusted with high-precision, and in a short period of time, even when mounting a chip component with low pressurizing force. [Solution] Provided is a parallelism adjustment method and a parallelism adjustment apparatus for a mounting apparatus, which is provided with: a parallelism adjustment unit for changing the inclination of the face of a bonding tool or a substrate stage; a driving means for driving the parallelism adjustment unit; a height detecting means for detecting the height position of the bonding tool. The parallelism adjustment method comprises: a process for pressing down the bonding tool onto the substrate stage with a prescribed pressure; a process wherein the driving means changes the inclination of the parallelism adjustment unit; a process for obtaining the position of the lowermost point of the bonding tool, from information about the bonding tool coming from the height detecting means while the inclination of the parallelism adjustment unit is being changed; and a process for maintaining an inclination position of the parallelism adjustment unit acquired when the bonding tool was at the lowermost point.

INO NOBUYUKI (JP)
TERADA KATSUMI (JP)

PCT/JP2011/073359

April 19, 2012

October 12, 2011

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TORAY ENG CO LTD (JP)
INO NOBUYUKI (JP)
TERADA KATSUMI (JP)

H01L21/60; H01L21/52; H05K13/04

WO2009084536A1	2009-07-09
WO2009119096A1	2009-10-01

JP2003224143A	2003-08-08
JP2010147048A	2010-07-01

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