PARTITION REPAIR METHOD

WIPO Patent Application WO/2011/129283

A1

Disclosed is a partition repair method that is capable of repairing a missing part defect that arises in a partition that is formed to form a plurality of spaces upon a substrate, said partition being ink-repellent in the upper face thereof and ink-attracting in the lateral faces thereof, so as to impart the ink-repellency only to the face of the repair portion that corresponds to the upper portion of the partition thereof; and which is capable of preventing a lack of uniformity in a pixel film thickness in an inkjet for pixel forming after a repair. A method of repairing a defect that arises in partition that is formed to form a plurality of spaces upon a substrate, said partition being ink-repellent in the upper face thereof and ink-attracting in the lateral face thereof, includes the steps of detecting a defect; filling at least all defects when hardening a defect with a hardening repair fluid, said repair fluid being ink-repellent, and applying same in a coating that is approximately the same size as the surrounding partition; hardening the hardening repair fluid into the repair portion; and projecting laser light upon the faces of the repair portion that are contiguous with the lateral faces of the partition thereof.

ISHIZEKI KENJI (JP)
AKIYAMA TATSUYA (JP)
TAKAHASHI HIDEYUKI (JP)

PCT/JP2011/058935

October 20, 2011

April 08, 2011

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ASAHI GLASS CO LTD (JP)
ISHIZEKI KENJI (JP)
AKIYAMA TATSUYA (JP)
TAKAHASHI HIDEYUKI (JP)

G02B5/20; H01L51/50; H05B33/10; H05B33/12; H05B33/22

WO2010013654A1	2010-02-04
WO2006035621A1	2006-04-06

JP2002022933A	2002-01-23
JP2006072176A	2006-03-16
JP2009104030A	2009-05-14

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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