PATCH PREPARATION - TEIKOKU SEIYAKU KK

Title:

PATCH PREPARATION

Document Type and Number:

WIPO Patent Application WO/2015/133329

Kind Code:

A1

Abstract:

　Provided is a patch preparation having improved adhesion to an adherend so as to be able to continuously administer a drug, particularly a drug having systemic action, in a consistent fashion for an extended period. The patch preparation has a laminated structure comprising, in order from the skin-adhering side: an adhesive patch layer comprising a pressure-sensitive plaster containing a drug, and an adhesive patch support; and a cover layer, wherein the patch preparation is characterized in that a cushioning material is arranged between the cover layer and the adhesive patch support of the adhesive patch layer, the cover layer being of a size covering an area beyond the peripheral edges of the adhesive patch layer, and a masking film is further arranged between the cover layer and the cushioning material.

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Inventors:

KAWAKAMI SATOSHI (JP)

Application Number:

PCT/JP2015/055173

Publication Date:

September 11, 2015

Filing Date:

February 24, 2015

Export Citation:

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Assignee:

TEIKOKU SEIYAKU KK (JP)

International Classes:

A61K9/70; A61K31/445; A61K47/34; A61P25/28

Domestic Patent References:

WO2009119673A1	2009-10-01
WO2012008396A1	2012-01-19

Foreign References:

JPH1143431A	1999-02-16
JPH11343232A	1999-12-14
JP2008037798A	2008-02-21
JP2007099759A	2007-04-19
JP2005224981A	2005-08-25

Other References: