Title:
PATTERN FORMATION METHOD AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/039760
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a pattern formation method capable of forming a pattern excellent in resolution using a main chain scission-type resist, and a manufacturing method for an electronic device. This pattern formation method comprises: a step for forming a resist film on a support using a resist composition containing a polymer the molecular weight of which is reduced by cutting of a main chain bond by exposure; a step for exposing the resist film; and a step for developing the exposed resist film using a developing solution. The developing solution contains, as a main component, an alcohol-based solvent containing a branched chain hydrocarbon radical.
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Inventors:
TSUCHIHASHI TORU (JP)
Application Number:
PCT/JP2020/031953
Publication Date:
March 04, 2021
Filing Date:
August 25, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; G03F7/20; G03F7/32
Domestic Patent References:
| WO2019151021A1 | 2019-08-08 | |||
| WO2017130870A1 | 2017-08-03 |
Foreign References:
| JP2018081307A | 2018-05-24 | |||
| JP2006301132A | 2006-11-02 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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