PATTERN FORMATION METHOD, PROTECTIVE-FILM-FORMING COMPOSITION, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2016/052178

A1

The present invention pertains to a pattern formation method and a protective-film-forming composition suitable for use in the pattern formation method, wherein said method provides an excellent exposure latitude and depth of focus, and is capable of forming patterns in which line-edge roughness is restricted. This pattern formation method includes: a step for coating a substrate with a radiation-sensitive or actinic-ray-sensitive resin composition and forming a radiation-sensitive or actinic ray-sensitive film; a step for coating the radiation-sensitive or actinic-ray-sensitive film with a protective-film-forming composition and forming a protective film; a step for exposing the radiation-sensitive or actinic-ray-sensitive film, which is coated with the protective film; and a step for developing the exposed radiation-sensitive or actinic-ray-sensitive film in a developing solution containing an organic solvent; wherein the protective film contains a resin (X) and a compound (A) containing at least one group or bond selected from the group consisting of an ether bond, a thioether bond, a hydroxyl group, a thiol group, a carbonyl bond, and an ester bond.

INOUE NAOKI (JP)
TANGO NAOHIRO (JP)
YAMAMOTO KEI (JP)
SHIRAKAWA MICHIHIRO (JP)
GOTO AKIYOSHI (JP)

PCT/JP2015/076189

April 07, 2016

September 15, 2015

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FUJIFILM CORP (JP)

G03F7/11; C08F20/10; G03F7/038; G03F7/039; G03F7/32; H01L21/027

JP2013097003A	2013-05-20
JP2013097002A	2013-05-20
JP2013033227A	2013-02-14
JP2014167614A	2014-09-11
JP2014056194A	2014-03-27
JP2013151592A	2013-08-08
JP2013073124A	2013-04-22

NAKASHIMA Junko et al. (JP)
Junko Nakajima (JP)

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