Title:
PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/119396
Kind Code:
A1
Abstract:
A pattern forming method which comprises: a step for forming a resist film using an active light sensitive or radiation sensitive resin composition that contains a resin, the solubility of which in a developer liquid containing an organic solvent is reduced by being increased in the polarity by the action of an acid, and a compound that is decomposed upon irradiation of active light or radiation and generates an acid; a step for forming a protective film on the resist film using a protective film composition; a step for exposing the resist film having the protective film to an electron beam or extreme ultraviolet light; and a step for development with use of the developer liquid containing an organic solvent. This pattern forming method exhibits excellent resolving power in the formation of an isolated space pattern having an ultra-narrow space width (for example, a space width of 30 nm or less).
Inventors:
IWATO KAORU (JP)
Application Number:
PCT/JP2014/050846
Publication Date:
August 07, 2014
Filing Date:
January 17, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; G03F7/038; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
| WO2013002417A1 | 2013-01-03 |
Foreign References:
| JP2008309878A | 2008-12-25 | |||
| JP2010217884A | 2010-09-30 | |||
| JP2010160283A | 2010-07-22 | |||
| JP2010016158A | 2010-01-21 | |||
| JP2001166489A | 2001-06-22 | |||
| JP2001022080A | 2001-01-26 | |||
| JP2008286924A | 2008-11-27 | |||
| JP2013061647A | 2013-04-04 | |||
| JP2013061648A | 2013-04-04 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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