Title:
PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/180069
Kind Code:
A1
Abstract:
Provided is a pattern forming method which forms a pattern that is capable of providing an object to be etched, which has excellent pattern uniformity. Also provided is a method for producing an electronic device, which comprises the above-described pattern forming method. A pattern forming method which comprises: a resist film formation step wherein a resist film is formed with use of a chemically amplified active light sensitive or radiation sensitive resin composition; a light exposure step wherein the resist film is exposed to light; a post exposure baking step wherein the light exposed resist film is heated; and a development step wherein the heated resist film is dry developed. The chemically amplified active light sensitive or radiation sensitive resin composition contains a resin which has a group that is decomposed by the action of an acid and is increased in the polarity, and a photoacid generator. The group that is decomposed by the action of an acid and is increased in the polarity has a structure wherein a polar group is protected by a leaving group that is separated by the action of an acid; and the leaving group contains an Si atom, while having a molecular weight of 500 or less.
More Like This:
Inventors:
FURUTANI HAJIME (JP)
SHIRAKAWA MICHIHIRO (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2018/006602
Publication Date:
October 04, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/075; C08F30/08; G03F7/004; G03F7/038; G03F7/039; G03F7/20; G03F7/36
Domestic Patent References:
| WO2017002430A1 | 2017-01-05 |
Foreign References:
| JPH02115853A | 1990-04-27 | |||
| JP2015025879A | 2015-02-05 | |||
| JP2003147022A | 2003-05-21 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
Download PDF: