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Patent Searching and Data


Title:
PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/132979
Kind Code:
A1
Abstract:
A pattern forming method for forming a fine pattern, said pattern forming method comprising: a first step for changing into a lyophilic nature a first pattern formation region, wherein a first pattern is to be formed, in a liquid-repellent first film having a lyophilic-lyophobic conversion function, said liquid-repellent first film being formed on a substrate, to reduce the film thickness; a second step for forming a second film having a flat surface on the first film; and a third step for drying the second film and thus forming the first pattern in the first pattern formation region.

Inventors:
MIYAMOTO KIMIAKI (JP)
Application Number:
PCT/JP2013/053398
Publication Date:
September 12, 2013
Filing Date:
February 13, 2013
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/288; H01L21/3205; H01L21/336; H01L21/768; H01L29/786
Foreign References:
JP2009026900A2009-02-05
JP2009026899A2009-02-05
JP2009026901A2009-02-05
JP2796575B21998-09-10
JP2002162630A2002-06-07
JP2003096034A2003-04-03
JP2003267982A2003-09-25
JPH11193345A1999-07-21
JPH11193346A1999-07-21
JPH11193347A1999-07-21
Other References:
D. K. OWENS; R. C. WENDT, JOURNAL OF APPLIED POLYMER SCIENCE, vol. 13, 1969, pages 1741
See also references of EP 2824695A4
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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Claims: