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Title:
PATTERN-MEASURING DEVICE AND COMPUTER PROGRAM
Document Type and Number:
WIPO Patent Application WO/2015/125504
Kind Code:
A1
Abstract:
In order to provide a pattern-measuring device and a computer program that quantitatively evaluate the effects brought about by the presence of pattern deformations in a circuit, this invention proposes a pattern-measuring device that measures first distances between first edges in pattern data being measured and second edges that correspond to said first edges in a benchmark pattern that corresponds to the pattern being measured. Said pattern-measuring device computes a score for the first edges or the pattern being measured on the basis of the first distances and second distances between the first edges and/or the second edges and third edges that are adjacent to but different from the first and second edges.

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Inventors:
TOYODA YASUTAKA (JP)
SINDO HIROYUKI (JP)
Application Number:
PCT/JP2015/050195
Publication Date:
August 27, 2015
Filing Date:
January 07, 2015
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01B15/00; G01B15/04
Foreign References:
JP2002093875A2002-03-29
JP2007149055A2007-06-14
JP2009071271A2009-04-02
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
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