Title:
PATTERN PLATE FOR PLATING AND METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/144960
Kind Code:
A1
Abstract:
A pattern plate for plating is configured to transfer a transfer pattern formed by plating onto a board. The pattern plate for plating includes a base material and a plurality of transfer portions provided on the base material. Each of the plurality of transfer portions has a transfer surface configured such that the transfer pattern is formed by plating. The plurality of transfer portions are arranged on the base material so as to be electrically independent from each other. This pattern plate for plating can stabilize the quality of a thinned conductive pattern.
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Inventors:
NIRENGI TAKAYOSHI
IGUCHI HIDEO
IGUCHI HIDEO
Application Number:
PCT/JP2019/046283
Publication Date:
July 16, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C25D7/00; C23C18/32; H05K3/18; H05K3/20
Foreign References:
| JP2001127409A | 2001-05-11 | |||
| JP2007266324A | 2007-10-11 | |||
| JP2005183512A | 2005-07-07 | |||
| JPH02159789A | 1990-06-19 | |||
| JPH11274694A | 1999-10-08 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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