Title:
PATTERN SHAPE EVALUATION METHOD AND PATTERN SHAPE EVALUATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/001967
Kind Code:
A1
Abstract:
An image of the joint portion of a circuit pattern manufactured using a design pattern for double patterning is read out, and a target boundary line and an evaluation region are set (701, 711, 721) on the image. In the evaluation region, image processing is performed (702, 712, 722) in the direction of the target boundary line, and furthermore, binarization processing is performed (703, 713, 723). On the basis of the image obtained in such a manner, presence/absence of a pattern defect is determined.
Inventors:
TOYODA YASUTAKA (JP)
MATSUOKA RYOICHI (JP)
MATSUOKA RYOICHI (JP)
Application Number:
PCT/JP2010/061039
Publication Date:
January 06, 2011
Filing Date:
June 29, 2010
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
TOYODA YASUTAKA (JP)
MATSUOKA RYOICHI (JP)
TOYODA YASUTAKA (JP)
MATSUOKA RYOICHI (JP)
International Classes:
G01B15/04; G01N23/225; H01L21/66
Foreign References:
| JP2009141124A | 2009-06-25 | |||
| JP2000340496A | 2000-12-08 | |||
| JP2008118033A | 2008-05-22 | |||
| JPH07225195A | 1995-08-22 | |||
| JPH09281056A | 1997-10-31 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p. c. (JP)
Patent business corporation Asamura patent firm (JP)
Patent business corporation Asamura patent firm (JP)
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