Title:
PCB BOARD HEATING METHOD AND APPARATUS, PCB BOARD COMPONENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/076395
Kind Code:
A1
Abstract:
A PCB board (6) heating method and apparatus (100), a PCB board component (60) and an electronic device. In the PCB board (6) heating method, a heating element (2) is embedded in a middle layer of the PCB board (6), and the heating method of the PCB board (6) comprises the following steps: collecting an ambient temperature where the PCB board (6) is located; and controlling the heating element (2) to heat the PCB board (6) when the ambient temperature is less than a pre-set ambient temperature. The PCB board (6) heating method can effectively improve the ability of an electronic device with the PCB board (6) to start normally or work normally in a low temperature environment.
Inventors:
ZHOU SHIXIAN (CN)
ZHANG XING (CN)
ZHANG XING (CN)
Application Number:
PCT/CN2016/104929
Publication Date:
May 03, 2018
Filing Date:
November 07, 2016
Export Citation:
Assignee:
BANGYAN TECH CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| CN201557323U | 2010-08-18 | |||
| CN104380837A | 2015-02-25 | |||
| CN202587584U | 2012-12-05 | |||
| CN1633230A | 2005-06-29 |
Attorney, Agent or Firm:
SHENZHEN DEJIN INTELLECTUAL PRORWETY AGECY CO. LTD (CN)
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