Title:
PCB PROVIDED WITH HIGH HEAT DISSIPATION STRUCTURE AND PROCESSING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/169037
Kind Code:
A1
Abstract:
Disclosed are a PCB provided with a high heat dissipation structure and a processing method therefor, said PCB comprising: a core board, a metal substrate, and a prepreg; the core board and the metal substrate are press-fittedly connected by means of the prepreg; a plurality of first heat dissipation areas are disposed on the core board and are used for placing high-power components, a plurality of first heat dissipation holes are provided on the first heat dissipation areas, and the first heat dissipation holes are connected by means of heat transfer wires; hole copper is provided on hole walls of the first heat dissipation holes; the core board and metal substrate are selected according to heat dissipation requirements of the high-power components; after manufacturing the core board and the metal substrate, and the core board and the metal substrate are press-fittedly connected by means of the prepreg. By means of the design of the first heat dissipation areas, the plurality of first heat dissipation holes and a filler in the holes, heat dissipation requirements can be met without significantly exceeding heat dissipation requirements of a product, thereby avoiding excessive costs and the wasting of resources.
Inventors:
TANG HONGHUA (CN)
HUANG SHUANGSHUANG (CN)
FAN TINGHUI (CN)
CHEN CHUN (CN)
WU SHOUKUN (CN)
XU DEGANG (CN)
WANG BIN (CN)
HUANG SHUANGSHUANG (CN)
FAN TINGHUI (CN)
CHEN CHUN (CN)
WU SHOUKUN (CN)
XU DEGANG (CN)
WANG BIN (CN)
Application Number:
PCT/CN2022/139064
Publication Date:
September 14, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO LTD (CN)
International Classes:
H05K1/02
Domestic Patent References:
| WO2007115520A1 | 2007-10-18 |
Foreign References:
| CN114727473A | 2022-07-08 | |||
| CN108293293A | 2018-07-17 | |||
| CN210670776U | 2020-06-02 | |||
| CN209882204U | 2019-12-31 | |||
| US6591897B1 | 2003-07-15 |
Attorney, Agent or Firm:
SHENZHEN QIANNA PATENT AGENCY LTD (CN)
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