Title:
PEELING DEVICE AND PEELING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/003516
Kind Code:
A1
Abstract:
This peeling device 1 has: a metal mask fixing frame 11 that holds and fixes a metal mask 10 which has an opening 13 defining the range of a section to be peeled 46 of an uppermost layer substrate 48; a pressing roller 32 that presses an adhesive layer 20b of adhesive tape 20 from an upper surface 10a of the metal mask 10 against the uppermost layer substrate 48 within the opening 13; and a peeling head 6. Furthermore, the peeling device 1 is characterized by having a peeling head driving mechanism 19 that can switch the movement direction of the peeling head 6 and that moves the pressing roller 32 in a state where the adhesive layer 20b is pressed against the uppermost layer substrate 48. This peeling device 1 makes it possible to peel the section to be peeled 46 of the uppermost layer substrate 48 from a lower layer substrate 47 and to cut and divide the section to be peeled 46 from the uppermost layer substrate 48, regardless of the size, shape, and arrangement of the section to be peeled 46.
Inventors:
KATO KAZUHIKO (JP)
HANYU SHINICHI (JP)
HANYU SHINICHI (JP)
Application Number:
PCT/JP2018/024901
Publication Date:
January 02, 2020
Filing Date:
June 29, 2018
Export Citation:
Assignee:
BEAC CO LTD (JP)
International Classes:
H01L21/683; B65H41/00
Foreign References:
| JP2011044262A | 2011-03-03 | |||
| JPH03252484A | 1991-11-11 | |||
| JPH0648643A | 1994-02-22 |
Attorney, Agent or Firm:
MEBUKI IP LAW FIRM et al. (JP)
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