Title:
PHENOL MIXTURE, EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRICAL/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/002902
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a phenol mixture that is optimal as an epoxy resin production raw material and that is capable of realizing the high heat resistance required in recent years; and an epoxy resin, an epoxy resin composition, a cured product, and an electrical/electronic component that use the phenol mixture. The problem is solved by: a phenol mixture containing 3,3',5,5'-tetramethyl-4,4'-biphenol as a main component, wherein the phenol mixture contains more than 0.3 wt% but less than 10.0 wt% of polyphenylene ether, and contains 1.3-4.0 wt% of tetramethyldiphenoquinone; and an epoxy resin, an epoxy resin composition, a cured product, and an electrical/electronic component that use the phenol mixture.
Inventors:
OTA KAZUMASA (JP)
Application Number:
PCT/JP2022/027636
Publication Date:
January 26, 2023
Filing Date:
July 14, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/22; C08K5/13; C08L71/12
Foreign References:
| JP2006008652A | 2006-01-12 | |||
| JP2005126410A | 2005-05-19 | |||
| JPH03275638A | 1991-12-06 | |||
| JPS6372638A | 1988-04-02 | |||
| JP2002128861A | 2002-05-09 | |||
| JP2003327554A | 2003-11-19 | |||
| JP2004002830A | 2004-01-08 | |||
| JPS61268641A | 1986-11-28 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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