PHENOLIC FOAM INSULATION MATERIAL AND PREPARATION METHOD THEREFOR

WIPO Patent Application WO/2021/100964

A1

Disclosed is a phenolic foam insulation material prepared by expanding and curing an expandable phenolic resin composition containing a phenolic resin, an expanding agent, an acidic catalyst, and an inorganic neutralizing agent, wherein the inorganic neutralizing agent is at least one selected from the group consisting of aluminum hydroxide, zinc oxide, calcium carbonate, and magnesium carbonate, and the inorganic neutralizing agent is coated with a binder. Such a phenolic foam insulation material and a preparation method therefor can prevent cell cracking and insulation performance degradation caused by the use of an inorganic neutralizing agent and can suppress the occurrence of metal corrosion upon contact with metal materials. In addition, the removal of unreacted formaldehyde inside the phenolic foam insulation material can lead to a safe use as an insulation material.

JP3126144	Description: A multilayer opaque film structure having low surface friction and a method for producing the same.
JP7210559	geogrid
JPH0247037	OPAQUE ORIENTED FILM WITH ALKENYL AROMATIC POLYMER

PARK JAE DONG (KR)
KIM SUNG NAM (KR)
KIM TAE HYUN (KR)
LA SUNG WON (KR)

PCT/KR2019/017652

May 27, 2021

December 13, 2019

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HI KOREA CO LTD (KR)

C08J9/00; B29C44/34; C08K3/22; C08K3/26; C08K5/21; C08K9/08; C08L61/04; E04B1/80

KR101333877B1	2013-11-27
KR100613887B1	2006-08-21
JP2014055305A	2014-03-27
JP2005054026A	2005-03-03
JPH0940740A	1997-02-10

BAE, Young Jun et al. (KR)

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