Title:
PHOTOCURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/225029
Kind Code:
A1
Abstract:
The present invention provides: a photocurable composition that, although including metal oxide microparticles at high concentration, is such that the metal oxide microparticles are satisfactorily dispersed and leakability to a to-be-coated substrate is satisfactory; a cured product of said photocurable composition; and a cured film formation method that uses the photocurable composition. A photocurable resin composition contains a photopolymerizable compound (A), metal oxide microparticles (B), an initiator (C), and a solvent (S). A compound having a radical-polymerizable-group-containing group or a cationically-polymerizable-group-containing group is used as the photopolymerizable compound (A). As the solvent (S), a plurality of solvents (S1) are used that have a specific structure that includes an oxyalkylene group, and are such that the Hildebrand solubility parameter value thereof is 21.0 MPa0.5 (alternatively, the solvent (S1) and another solvent (S2) are used at a prescribed mass ratio).
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Inventors:
URAKAWA KAZUKI (JP)
MIYAZAKI MASATO (JP)
MIYAZAKI MASATO (JP)
Application Number:
PCT/JP2022/018485
Publication Date:
October 27, 2022
Filing Date:
April 21, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F2/44; C08F22/10; C09D4/00; C09D4/02; C09D7/20; C09D7/61
Domestic Patent References:
| WO2004061006A1 | 2004-07-22 | |||
| WO2016009894A1 | 2016-01-21 |
Foreign References:
| JP2009102623A | 2009-05-14 | |||
| JP2002105112A | 2002-04-10 | |||
| JP2003084651A | 2003-03-19 | |||
| JP2017214465A | 2017-12-07 | |||
| JP2008248169A | 2008-10-16 | |||
| JP2008019422A | 2008-01-31 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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