Title:
PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/122025
Kind Code:
A1
Abstract:
The disclosed photocurable resin composition exhibits a good black color while also being highly sensitive. A dry film resulting therefrom feels very dry to the touch. The disclosed photocurable resin composition exhibits minimal outgassing, e.g. during curing. When used, for example, to form a solder resist for a printed circuit board, said photocurable resin composition provides excellent alignment precision, high productivity, and high reliability. The disclosed photocurable resin composition is characterized by containing: a photopolymerization initiator, each molecule of which has two oxime ester groups; a colorant; a carboxyl-containing resin; and a compound, each molecule of which has a plurality of ethylene unsaturated groups.
Inventors:
SHIBASAKI YOKO (JP)
ARIMA MASAO (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2011/001921
Publication Date:
October 06, 2011
Filing Date:
March 30, 2011
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
SHIBASAKI YOKO (JP)
ARIMA MASAO (JP)
SHIBASAKI YOKO (JP)
ARIMA MASAO (JP)
International Classes:
G03F7/031; G03F7/004; H05K3/28
Domestic Patent References:
| WO2008138732A1 | 2008-11-20 | |||
| WO2008138733A1 | 2008-11-20 | |||
| WO2011007566A1 | 2011-01-20 |
Foreign References:
| JP4344400B1 | 2009-10-14 | |||
| JP2007197390A | 2007-08-09 | |||
| JP2008257045A | 2008-10-23 | |||
| JP2007197340A | 2007-08-09 | |||
| JP2009519991A | 2009-05-21 | |||
| JP2005097141A | 2005-04-14 | |||
| JP2010256717A | 2010-11-11 |
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)
Patent business corporation Amagi international patent firm (JP)
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Claims: