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Title:
PHOTORESIST RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/115029
Kind Code:
A1
Abstract:
Provided is a photoresist resin composition having excellent sensitivity and resolution and high film retention, as well as other properties that are at least commensurate with those of the commonly used compositions. The photoresist resin composition contains a high-ortho-novolac phenol resin, a naphthoquinone diazide derivative, and a solvent, the high-ortho-novolac phenol resin being obtained by reacting an aldehyde and one or two compounds selected from meta-cresol, para-cresol, 3,5-xylenol, and 2,3,5-trimethylphenol in the presence of an acid catalyst at a temperature of 110-220°C.

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Inventors:
IMAMURA YUJI (JP)
Application Number:
PCT/JP2012/053943
Publication Date:
August 30, 2012
Filing Date:
February 20, 2012
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
IMAMURA YUJI (JP)
International Classes:
G03F7/023; C08G8/02; H01L21/027
Foreign References:
JPH02272457A1990-11-07
JPH09222728A1997-08-26
JP2010230850A2010-10-14
JP2001051419A2001-02-23
JPH0534912A1993-02-12
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
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Claims:



 
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