PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2010/024295

A1

A photosensitive adhesive composition that can form adhesive patterns by forming an adhesive layer on an adherend and performing a radiation exposure and development by a developing solution. The photosensitive adhesive composition has solubility and developability, and the film thickness T1 (μm) of the adhesive pattern formed after the development satisfies the conditions represented by formula (1). (T1/T0)×100≥90 (1) [In the formula (1), T0 represents the film thickness (μm) of the adhesive layer before the development.]

KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)

PCT/JP2009/064871

March 04, 2010

August 26, 2009

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HITACHI CHEMICAL CO LTD (JP)
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)

C09J201/00; C09J4/02; C09J7/00; C09J7/02; C09J163/00; C09J179/08; C09J201/06; H01L21/52

WO2007004569A1	2007-01-11
WO2008123110A1	2008-10-16
WO2008149625A1	2008-12-11
WO2009090922A1	2009-07-23
WO2007004569A1	2007-01-11

JP2008088403A	2008-04-17
JP2003113205A	2003-04-18
JPH01179935A	1989-07-18
JPS385997B1
JP2001270943A	2001-10-02
JP2008007744A	2008-01-17
JP2008003582A	2008-01-10
JP2008260907A	2008-10-30
JP2009164574A	2009-07-23
JP2009227959A	2009-10-08
JP2000290501A	2000-10-17
JP2001329233A	2001-11-27
JPH1124257A	1999-01-29

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, vol. 12, 1999, pages 313 - 314
CHEMISTRY OF MATERIALS, vol. 11, 1999, pages 170 - 176
JOURNAL OF AMERICAN CHEMICAL SOCIETY, vol. 118, 1996, pages 12925
POLYMER JOURNAL, vol. 28, 1996, pages 795

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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