Title:
PHOTOSENSITIVE ASSEMBLY AND METHOD FOR FORMING SAME, LENS MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/087595
Kind Code:
A1
Abstract:
Disclosed are a photosensitive assembly and a method for forming same, a lens module and an electronic device. The method for forming a photosensitive assembly (510) comprises: providing a light-transmitting cover plate (30, 200); providing a photosensitive chip (10, 400), wherein the photosensitive chip comprises a photosensitive area (10a, 400a) and a peripheral area (10b, 400b) encircling the photosensitive area (10a, 400a); attaching the light-transmitting cover plate (30, 200) to the photosensitive chip (10, 400) by means of a bonding layer (20, 300), wherein the bonding layer (20, 300) is located within the peripheral area (10b, 400b), and the light-transmitting cover plate (30, 200), the bonding layer (20, 300) and the photosensitive chip (10, 400) encircle a cavity (25, 350) accommodating the photosensitive area (10a, 400a); forming a sealing layer (500) which at least covers a side wall of the bonding layer (20, 300) and a side wall of the light-transmitting cover plate (30, 200); and increasing the sealing performance of the cavity (25, 350). In the subsequent packaging process, the sealing layer (500) can prevent a solution, such as water, from entering the cavity (25, 350), thereby improving the waterproof ability of the photosensitive assembly (510) and the reliability of the lens module.
Inventors:
CHEN DA (CN)
Application Number:
PCT/CN2018/116849
Publication Date:
May 07, 2020
Filing Date:
November 22, 2018
Export Citation:
Assignee:
NINGBO SEMICONDUCTOR INT CORP (CN)
International Classes:
H01L27/146; G03B17/08; G03B30/00; H01L23/28
Foreign References:
US20110248367A1 | 2011-10-13 | |||
US20110248367A1 | 2011-10-13 | |||
CN103560138B | 2016-01-20 | |||
TW201123368A | 2011-07-01 | |||
CN204424256U | 2015-06-24 | |||
CN102902136A | 2013-01-30 | |||
US7227236B1 | 2007-06-05 |
Attorney, Agent or Firm:
INTEBRIGHT LLP (CN)
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