Title:
WAFER-LEVEL PACKAGING METHOD USING PHOTOLITHOGRAPHABLE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/087594
Kind Code:
A1
Abstract:
A wafer-level packaging method using a photolithographable bonding material, comprising: a substrate (300) and a plurality of first chips (110) are provided; a photolithographable layer (200) is formed on the substrate (300) or the first chips (110); a bonding layer (200) is imaged using photolithographic processing, and first through holes (215) are formed in the bonding layer (200); by means of the bonding layer (200), the first chips (110) are pre-bonded to the substrate (300), the first chips (110) corresponding with the first through holes (215); a packaging material (455) is provided, and using thermocompression bonding processing, bonding is accomplished between the substrate (300) and the first chips (110) by means of the bonding layer (200), and the packaging material (455) is caused to fill the space between the first chips (110) and to cover the first chips (110) and the substrate (300); after thermocompression bonding processing, the surface of the substrate (300) facing away from the first chips (110) is etched, and second through holes (305) passing through the substrate (300) and in communication with the first through holes (215) are formed, the second through holes (305) and the first through holes (215) being used to compose first electrically conductive through holes (250); and first conductive columns (520) electrically connected to the first chips (110) are formed in the first electrically conductive through holes (250). In the present method, packaging efficiency is improved, while also improving the yield and dependability of packaging structures.
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Inventors:
SHI HU (CN)
LIU MENGBIN (CN)
LIU MENGBIN (CN)
Application Number:
PCT/CN2018/116848
Publication Date:
May 07, 2020
Filing Date:
November 22, 2018
Export Citation:
Assignee:
NINGBO SEMICONDUCTOR INT CORP (CN)
International Classes:
H01L21/48
Foreign References:
| CN108666264A | 2018-10-16 | |||
| CN106952837A | 2017-07-14 | |||
| CN102593023A | 2012-07-18 | |||
| CN103400808A | 2013-11-20 | |||
| CN107633997A | 2018-01-26 | |||
| US20080169548A1 | 2008-07-17 |
Attorney, Agent or Firm:
INTEBRIGHT LLP (CN)
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