PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Title:

PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2018/100730

Kind Code:

A1

Abstract:

Provided is a photosensitive element 1 comprising a support film 10 and a photosensitive layer 20 disposed on the support film 10, wherein the photosensitive layer 20 contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator, and the number of defects having diameters of 2 μm or more on a principal surface 12 on the photosensitive layer 20 side of the support film 10 is 30 or fewer per 2 mm2.

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Inventors:

KUME MASAKAZU (JP)
MATSUMURA RYO (JP)

Application Number:

PCT/JP2016/085893

Publication Date:

June 07, 2018

Filing Date:

December 02, 2016

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

G03F7/004

Domestic Patent References:

WO2008093643A1

2008-08-07

Foreign References:

JP2015166866A	2015-09-24
JP2016042170A	2016-03-31
JP2016087854A	2016-05-23