Title:
PHOTOSENSITIVE FILM AND PHOTOSENSITIVE-FILM MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/161965
Kind Code:
A1
Abstract:
The present disclosure provides a photosensitive film and an application thereof, the photosensitive film satisfying, at a percentage of 90% to 100%, the relationship Tg(x)×(98.8/100) < T(x) < Tg(x)×(101.2/100), where W indicates, in millimeters, the width of the film; x indicates, in millimeters, the distance in the width direction of the film from one end of the film to the position of the film where the thickness of the film is measured; Ta indicates, in millimeters, the average thickness of the film measured in the width direction of the film; Tg(x) indicates, in millimeters, a target value for the thickness of the film expressed in the following equation; and T(x) indicates, in millimeters, the thickness of the film measured at a position a distance x from said one end of the film in the width direction of the film.
Inventors:
KAIHOKO HIROYUKI (JP)
Application Number:
PCT/JP2021/004621
Publication Date:
August 19, 2021
Filing Date:
February 08, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G06F3/041; G06F3/044; H05K3/06
Domestic Patent References:
| WO2018047688A1 | 2018-03-15 |
Foreign References:
| JP2008233778A | 2008-10-02 | |||
| JPH0653132A | 1994-02-25 | |||
| JP2010198032A | 2010-09-09 | |||
| JP2007264187A | 2007-10-11 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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