Title:
PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, KIT, AND PRODUCTION METHOD FOR PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/163859
Kind Code:
A1
Abstract:
A photosensitive layer included in a laminate having a water-soluble resin layer and the photosensitive layer. The photosensitive layer is a layer formed from a photosensitive resin composition including: a compound that generates acid as a result of irradiation by at least either an active ray or radiation; a resin having a dissolution rate relative to butyl acetate that changes as a result of the action of the acid; and water. The water content in the photosensitive resin composition is 0.008%–1% by mass. The present invention also pertains to a laminate related to this photosensitive layer, a photosensitive resin composition, a kit, and a production method for the photosensitive resin composition.
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Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2019/006427
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F20/28; G03F7/039; G03F7/11; G03F7/20; H01L21/336; H01L29/786; H01L51/05; H01L51/40
Domestic Patent References:
| WO2016175220A1 | 2016-11-03 |
Foreign References:
| JP2006243293A | 2006-09-14 | |||
| JP2014098889A | 2014-05-29 | |||
| JP2006343704A | 2006-12-21 | |||
| JP2012058304A | 2012-03-22 | |||
| JP2011169980A | 2011-09-01 | |||
| JPH0922115A | 1997-01-21 | |||
| US20050221219A1 | 2005-10-06 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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