Title:
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190801
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive multilayer resin film having a first resin composition layer and a second resin composition layer, the first resin composition layer and the second resin composition layer each containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, and (D) an inorganic filler. Using the letter a to denote the amount of weight reduction when the photosensitive multilayer resin film is irradiated with ultraviolet rays of 2 J/cm2 and then cured by heating for 1 hour at 170°C, after which the film is roughened under prescribed roughening conditions and in a state in which the surface of the first resin composition layer is exposed and the surface of the second resin composition layer is not exposed, and using the letter b to denote the amount of weight reduction when the film is roughened in a state in which the surface of the second resin composition layer is exposed and the surface of the first resin composition layer is not exposed, a is less than b and a is 10 g/m2 or less. The present invention also relates to a printed wiring board that uses said photosensitive multilayer resin film, a method for producing said printed wiring board, and a semiconductor package.
Inventors:
YUKIOKA RYO (JP)
KONNO YUKO (JP)
AYUGASE TOMOHIRO (JP)
KONNO YUKO (JP)
AYUGASE TOMOHIRO (JP)
Application Number:
PCT/JP2023/013045
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/004; G03F7/095; H05K1/03
Domestic Patent References:
| WO2022045237A1 | 2022-03-03 |
Foreign References:
| JP2006285179A | 2006-10-19 | |||
| JP2002243931A | 2002-08-28 | |||
| JPH0317650A | 1991-01-25 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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