Title:
PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190800
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the photosensitive resin film has a first surface and a second surface on the opposite side from the first surface, and the concentration of fluorine atoms at a site at a depth of 1 μm from the first surface is lower than the concentration of fluorine atoms at a site at a depth of 1 μm from the second surface.
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Inventors:
KONNO YUKO (JP)
AYUGASE TOMOHIRO (JP)
YUKIOKA RYO (JP)
AYUGASE TOMOHIRO (JP)
YUKIOKA RYO (JP)
Application Number:
PCT/JP2023/013043
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/004; G03F7/032; G03F7/033; G03F7/095; H05K1/03; H05K3/46
Domestic Patent References:
| WO2021253727A1 | 2021-12-23 |
Foreign References:
| JP2006285179A | 2006-10-19 | |||
| JP2005055655A | 2005-03-03 | |||
| JP2013173841A | 2013-09-05 | |||
| JP2017088438A | 2017-05-25 | |||
| JP2019179200A | 2019-10-17 | |||
| JP2022025366A | 2022-02-10 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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