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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND COLOR FILTER
Document Type and Number:
WIPO Patent Application WO/2023/119900
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which has excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient hardness and solvent resistance. This photosensitive resin composition contains a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D). The resin (A) contains a structural unit (a-1) having at least one group selected from the group consisting of an active methylene group and an active methine group, a structural unit (a-2) having a group that reacts due to the action of light and/or heat, and a structural unit (a-3) having an acid group.

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Inventors:
HARA TSUKASA (JP)
Application Number:
PCT/JP2022/040995
Publication Date:
June 29, 2023
Filing Date:
November 02, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/038; C08F220/28; G02B5/20; G03F7/004
Domestic Patent References:
WO2019156000A12019-08-15
Foreign References:
JP2018009059A2018-01-18
JP2016029151A2016-03-03
JP2018106172A2018-07-05
JP2012073604A2012-04-12
JP2007034134A2007-02-08
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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