PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND ELECTRONIC DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/018290

Kind Code:

A1

Abstract:

This photosensitive resin composition is used for the purpose of forming a permanent film, and contains (A) a polyamide resin having a structure that is selected from the group consisting of polybenzoxazole structures, polybenzoxazole precursor structures, polyimide structures and polyimide precursor structures, (B) a photoacid generator, (C) an adhesion promoter and (D) an organic solvent. The organic solvent (D) contains a compound that has an ether bond and an amide bond in each molecule.

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Inventors:

OTANI SHOICHIRO (JP)
TANAKA YUMA (JP)

Application Number:

PCT/JP2016/071229

Publication Date:

February 02, 2017

Filing Date:

July 20, 2016

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)

International Classes:

G03F7/004; C08G69/26; G03F7/023; G03F7/075

Domestic Patent References:

WO2014115233A1

2014-07-31

Foreign References:

JP2007065488A	2007-03-15
JP2006119271A	2006-05-11
JP5672403B1	2015-02-18

Attorney, Agent or Firm:

HAYAMI Shinji (JP)

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