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Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR FORMING SAME, PARTITION WALL, AND IMAGE DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/249070
Kind Code:
A1
Abstract:
This photosensitive resin composition contains (a) an alkali-soluble resin, (b) a photoinitiator, and (c) an ethylenically unsaturated compound, and is characterized in that the mass ratio ((a) alkali-soluble resin / (c) ethylenically unsaturated compound) of the (a) alkali-soluble resin and the (c) ethylenically unsaturated compound is at least 5, and the (c) ethylenically unsaturated compound contains an ethylenically unsaturated compound (c1) having an alkylene oxide group and three or more ethylenically unsaturated groups.

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Inventors:
HIRAOKA SHIHARU (JP)
IKEDA MASAAKI (JP)
NAKATANI KAZUHIRO (JP)
SUNADOME TOMOKO (JP)
Application Number:
PCT/JP2023/023061
Publication Date:
December 28, 2023
Filing Date:
June 22, 2023
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
G03F7/027; C08F290/06; G03F7/004; H05B33/02; H05B33/12; H05B33/22; H10K50/10; H10K59/00
Domestic Patent References:
WO2020017576A12020-01-23
Foreign References:
JP2013033207A2013-02-14
JP2020515898A2020-05-28
JP2014002285A2014-01-09
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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