Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/068177
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that contains: (A) a silicone resin containing an acid-crosslinkable group; (B) an epoxy compound represented by formula (B); and (C) a photoacid generator. (In the formula, R51-R55 each independently represent a hydrogen atom or a saturated hydrocarbyl group having 1-6 carbon atoms.)
Inventors:
MARUYAMA HITOSHI (JP)
Application Number:
PCT/JP2022/038307
Publication Date:
April 27, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
G03F7/075; C08G59/26; C08G77/48; G03F7/004
Domestic Patent References:
| WO2018117373A1 | 2018-06-28 |
Foreign References:
| JP2021042337A | 2021-03-18 | |||
| JP2017161859A | 2017-09-14 | |||
| JP2016044229A | 2016-04-04 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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