Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/091997
Kind Code:
A1
Abstract:
The present invention relates to a positive photosensitive resin composition comprising (A) a modified novolac-type phenolic resin comprising an unsaturated hydrocarbon group, (B) a novolac-type phenolic resin obtained from meta-cresol and para-cresol, (C) a novolac-type phenolic resin obtained from ortho-cresol, (D) a compound that generates an acid from light, and (E) a polybasic acid or a polybasic acid anhydride. The content of the (E) component is less than 40 parts by mass relative to a total amount of 100 parts by mass of the (A) component, the (B) component, the (C) component, and the (D) component.
Inventors:
UEDA SATOKO (JP)
SAWABE KEN (JP)
SAWABE KEN (JP)
Application Number:
PCT/JP2013/082703
Publication Date:
June 19, 2014
Filing Date:
December 05, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/023; G03F7/004
Domestic Patent References:
| WO2012063635A1 | 2012-05-18 | |||
| WO2007026475A1 | 2007-03-08 |
Foreign References:
| JP2010145604A | 2010-07-01 | |||
| JP2010039237A | 2010-02-18 | |||
| JPH03208055A | 1991-09-11 | |||
| JPH09160232A | 1997-06-20 | |||
| JPH03225341A | 1991-10-04 | |||
| JPH03236216A | 1991-10-22 | |||
| JP2013228416A | 2013-11-07 | |||
| JP2012252095A | 2012-12-20 | |||
| JPH0627657A | 1994-02-04 | |||
| JP2000105466A | 2000-04-11 | |||
| JP2007316577A | 2007-12-06 | |||
| JP2008112134A | 2008-05-15 | |||
| JP2010039214A | 2010-02-18 |
Other References:
See also references of EP 2937731A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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