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Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR MEMS AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2010/001919
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition for an MEMS, which comprises (A) a photo-cationic polymerization initiator and (B) an epoxy resin having two or more epoxy groups on average per molecule, wherein the photo-cationic polymerization initiator (A) is a photo-cationic polymerization initiator (A-1) represented by formula (1).

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Inventors:
HONDA NAO (JP)
SAKAI RYO (JP)
IMAIZUMI NAOKO (JP)
ONO YOSHIYUKI (JP)
Application Number:
PCT/JP2009/062029
Publication Date:
January 07, 2010
Filing Date:
July 01, 2009
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
HONDA NAO (JP)
SAKAI RYO (JP)
IMAIZUMI NAOKO (JP)
ONO YOSHIYUKI (JP)
International Classes:
G03F7/004; C08G59/68; G03F7/038
Domestic Patent References:
WO2007118794A12007-10-25
WO2008007762A12008-01-17
WO2007119391A12007-10-25
WO2006077140A12006-07-27
Foreign References:
JP2008026667A2008-02-07
JP2007249193A2007-09-27
JP2008020839A2008-01-31
JP2008020841A2008-01-31
JPH11501909A1999-02-16
JP2007512414A2007-05-17
JP2008256980A2008-10-23
Attorney, Agent or Firm:
ASAMURA Kiyoshi et al. (JP)
Hiroshi Asamura (JP)
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