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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2001/002909
Kind Code:
A1
Abstract:
A photosensitive resin composition comprising a resin soluble in an alkaline solution, a photosensitive substance, and a compound containing a phenolic hydroxyl group and having a parameter (P) of 30 or more, the parameter (P) being represented by the following formula (1): parameter (P)= 13.0 x number of hydroxyl groups of additive number of benzene rings of additive + 14.0 x number of diazo coupling reaction sites of additive number of benzene rings of additive (1), wherein the number of diazo coupling reaction sites represents the number of the carbon atoms being present at an o-position or p-position to a hydroxyl group in the compound and having no substituents; and a method for improving dry etching resistance of a photosensitive resin composition using the photosensitive resin composition. The photosensitive resin composition can be used for forming a good pattern and has a high sensitivity and excellent resistance to dry etching.

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Inventors:
KAWATO SHUNJI (JP)
TAKAHASHI SHUICHI (JP)
Application Number:
PCT/JP2000/003925
Publication Date:
January 11, 2001
Filing Date:
June 16, 2000
Export Citation:
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Assignee:
CLARIANT INT LTD (CH)
KAWATO SHUNJI (JP)
TAKAHASHI SHUICHI (JP)
International Classes:
H01L21/027; G03F7/004; G03F7/022; (IPC1-7): G03F7/022; C08L101/00; H01L21/027
Foreign References:
JPH04251849A1992-09-08
JPH04211254A1992-08-03
JPH0436751A1992-02-06
JPH03200252A1991-09-02
JPH03200253A1991-09-02
JPH04299348A1992-10-22
JPH03259149A1991-11-19
JPH022560A1990-01-08
JPH0572728A1993-03-26
JPH07159990A1995-06-23
JPH10133368A1998-05-22
Attorney, Agent or Firm:
Kanao, Hiroki (Kandaawajicho 2-chome Chiyoda-ku Tokyo, JP)
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