Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/097992
Kind Code:
A1
Abstract:
The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.
Inventors:
KOMORI YUSUKE (JP)
KOSHINO MIKA (JP)
MIYOSHI KAZUTO (JP)
KOSHINO MIKA (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2013/083491
Publication Date:
June 26, 2014
Filing Date:
December 13, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/023; C08G73/10; C09D7/12; C09D179/08; G03F7/037
Domestic Patent References:
| WO2011030744A1 | 2011-03-17 | |||
| WO2008123053A1 | 2008-10-16 |
Foreign References:
| JP2007183388A | 2007-07-19 | |||
| JP2007156243A | 2007-06-21 | |||
| JP2008033283A | 2008-02-14 | |||
| JP2005041936A | 2005-02-17 | |||
| JP2011042701A | 2011-03-03 | |||
| JP2011202059A | 2011-10-13 |
Other References:
See also references of EP 2937732A4
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