PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE AND ORGANIC EL DISPLAY DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE AND ORGANIC EL DISPLAY DEVICE

Document Type and Number:

WIPO Patent Application WO/2015/046295

Kind Code:

A1

Abstract:

Provided are: a photosensitive resin composition which has improved chemical resistance and lower relative dielectric constant, while being able to provide a pattern having improved dimensional stability; a method for producing a cured film; a cured film; a liquid crystal display device; and an organic EL display device. A photosensitive resin composition which contains (A) a polymerizable component, (B) a photoacid generator and (C) a solvent. The polymerizable component (A) contains (1) a polymer (A1) that has (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and (a2) a constituent unit having a crosslinkable group and/or (2) a polymer (A2) that has the constituent unit (a1) and a polymer (A3) that has the constituent unit (a2). The polymerizable component (A) is also characterized in that: (3) at least one of the polymers (A1)-(A3) is a polymer that contains (a4) a constituent unit having a group that produces a carboxyl group by means of alkaline hydrolysis; or (4) a polymer (A4) that contains the constituent unit (a4) but does not contain the constituent unit (a1) and the constituent unit (a2) is additionally contained. The ratio of the constituent unit (a2) is 10-40% by mole and the ratio of the constituent unit (a4) is 1.0-20% by mole relative to all the constituent units of the polymerizable component (A).

Inventors:

MATSUDA TOMOKI (JP)
YAMADA SATORU (JP)
YAMAZAKI KENTA (JP)
SHIMOYAMA TATSUYA (JP)

Application Number:

PCT/JP2014/075366

Publication Date:

April 02, 2015

Filing Date:

September 25, 2014

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/039; G02F1/1333; G03F7/004; G03F7/40; H01L51/50; H05B33/22

Domestic Patent References:

WO2011065207A1

2011-06-03

Foreign References:

JP2013187408A	2013-09-19
JP2013011866A	2013-01-17
JP2012173438A	2012-09-10

Attorney, Agent or Firm:

SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)

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