Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE AND ORGANIC EL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/046501
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition which has high volume resistivity, while maintaining high sensitivity; a method for producing a cured film of this photosensitive resin composition; a cured film; a liquid crystal display device; and an organic EL display device.
A photosensitive resin composition which contains (A) a polymer component containing one or more polymers satisfying (1) and/or (2) described below, (B) a photoacid generator represented by general formula (I), and (C) a solvent.
(1) a polymer having (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and (a2) a constituent unit having a crosslinkable group
(2) a polymer having (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and a polymer having (a2) a constituent unit having a crosslinkable group
Inventors:
SAKITA KYOUHEI (JP)
Application Number:
PCT/JP2014/075854
Publication Date:
April 02, 2015
Filing Date:
September 29, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F212/14; C08F220/28; G02F1/1333; G03F7/004; H01L51/50; H05B33/22
Domestic Patent References:
| WO2011087011A1 | 2011-07-21 |
Foreign References:
| JP2014186309A | 2014-10-02 | |||
| JP2013083937A | 2013-05-09 | |||
| JP2004243676A | 2004-09-02 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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