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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/046502
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition which has high sensitivity and excellent pattern size stability; a method for producing a cured film; a cured film; a liquid crystal display device; and an organic EL display device. A photosensitive resin composition which contains (A) a polymer component containing one or more polymers satisfying (1) and/or (2) described below, and (B) a photoacid generator represented by general formula (I). (1) a polymer having (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and (a2) a constituent unit having a crosslinkable group (2) a polymer having (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and a polymer having (a2) a constituent unit having a crosslinkable group

Inventors:
SAKITA KYOUHEI (JP)
Application Number:
PCT/JP2014/075855
Publication Date:
April 02, 2015
Filing Date:
September 29, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F212/14; C08F220/26; C09K3/00; G03F7/039; G03F7/40; H01L21/027; H01L51/50; H05B33/22
Domestic Patent References:
WO1997047660A11997-12-18
Foreign References:
JPH09157350A1997-06-17
JPH09143212A1997-06-03
JP2011105645A2011-06-02
JP2011013502A2011-01-20
JP2011221494A2011-11-04
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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