PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED RESIN FILM, PATTERNED RESIN FILM, AND SEMICONDUCTOR CIRCUIT SUBSTRATE

WIPO Patent Application WO/2020/021827

A1

The photosensitive resin composition contains a polymer (A) having a terminal group represented by formula (a1) and a repeating structural unit represented by formula (a2), a crosslinking agent (B), and a photocation generator (C). [In formula (a1) and formula (a2), Y represents a reactive group that reacts with the crosslinking agent (B) under the action of the cation generated from the photocation generator (C) upon exposure to light; each X independently represents an oxygen atom, sulfur atom, ester bond, amide bond, or -SO2-; R1 represents a divalent hydrocarbon group or a divalent group provided by the introduction into a divalent hydrocarbon group of a functional group other than the aforementioned reactive group and heterocycles; and R2 represents a divalent hydrocarbon group, a divalent group provided by the introduction into a divalent hydrocarbon group of a functional group other than the aforementioned reactive group and heterocycles, or a heterocycle-containing group that does not have the aforementioned reactive group.]

YAMAGUCHI TORAHIKO (JP)
KANNO KIMIYUKI (JP)
TATARA RYOJI (JP)
KADOTA TOSHIAKI (JP)
HIFUMI RYOYU (JP)
ANABUKI SHOMA (JP)

PCT/JP2019/019657

January 30, 2020

May 17, 2019

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JSR CORP (JP)

C08G65/40; G03F7/038; G03F7/004; G03F7/20

WO2017043375A1	2017-03-16
WO2018066395A1	2018-04-12
WO2013080929A1	2013-06-06

JP2014102467A	2014-06-05
JP2017133034A	2017-08-03
KR20160079319A	2016-07-06

SSINPAT PATENT FIRM (JP)

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