Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM
Document Type and Number:
WIPO Patent Application WO/1994/019725
Kind Code:
A1
Abstract:
A photosensitive resin composition which comprises a polyamic ester having structural units (1a), (1b) and (1c) as the photosensitive resin and a sulfonamide derivative or a specified glycol ether acetate as the stabilizer and is especially excellent in viscosity stability, and a process for forming a high-resolution relief pattern by using said composition and a specified developer; wherein each symbol is as defined in the specification.
Inventors:
SASHIDA NOBUYUKI (JP)
BANBA TOSHIO (JP)
TAKEDA NAOSHIGE (JP)
YAMAMOTO MITSUHIRO (JP)
BANBA TOSHIO (JP)
TAKEDA NAOSHIGE (JP)
YAMAMOTO MITSUHIRO (JP)
Application Number:
PCT/JP1994/000231
Publication Date:
September 01, 1994
Filing Date:
February 16, 1994
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
SASHIDA NOBUYUKI (JP)
BANBA TOSHIO (JP)
TAKEDA NAOSHIGE (JP)
YAMAMOTO MITSUHIRO (JP)
SASHIDA NOBUYUKI (JP)
BANBA TOSHIO (JP)
TAKEDA NAOSHIGE (JP)
YAMAMOTO MITSUHIRO (JP)
International Classes:
G03F7/004; G03F7/012; G03F7/023; G03F7/037; G03F7/038; H05K1/00; (IPC1-7): G03F7/038; G03F7/004
Foreign References:
| JPS61254605A | 1986-11-12 | |||
| JPH04120542A | 1992-04-21 | |||
| JPH04291258A | 1992-10-15 | |||
| JPS617837A | 1986-01-14 | |||
| JPH01293341A | 1989-11-27 |
Other References:
See also references of EP 0637776A4
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